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Principle of lithography machine

Lithography machine, also known as mask alignment exposure machine, exposure system, lithography system. The principle is that in the process of processing the chip, the lithography machine transmits the light beam through the mask painted with the circuit diagram through a series of light source energy and shape control means, compensates various optical errors through the objective lens, reduces the circuit diagram in proportion and maps it onto the silicon wafer, and then develops it by chemical method to obtain the circuit diagram engraved on the silicon wafer.

The general lithography process should go through the processes of silicon wafer surface cleaning and drying, priming, spin coating photoresist, soft drying, alignment exposure, post drying, development, hard drying, laser etching and so on. After one lithography, the chip can continue to be glued and exposed. The more complex the chip, the more layers of the circuit diagram, and the more precise exposure control process is also required.

Lithography machine is one of the core equipment of chip manufacturing. It can be divided into several types according to its purpose: there are lithography machines for chip production; There is a lithography machine for packaging; There is also a projection lithography machine for LED manufacturing. (GuangKeJiYuanLi)